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| Balanced Three-chip SIDACtor Device Balanced Three-chip SIDACtor Device 1 2 3 6 5 4 This balanced protector is a surface mount alternative to the modified TO-220 package. Based on a six-pin surface mount SOIC package, it uses Teccor's patented "Y" (US Patent 4,905,119) configuration. It is available in surge current ratings up to 500 A. SIDACtor devices are used to enable equipment to meet various regulatory requirements including GR 1089, ITU K.20, K.21, and K.45, IEC 60950, UL 60950, and TIA-968 (formerly known as FCC Part 68). Electrical Parameters Part Number * P1553U_ P1803U_ P2103U_ P2353U_ P2703U_ P3203U_ P3403U_ P5103U_ A2106U_3 ** A5030U_3 ** VDRM Volts 130 150 170 200 230 270 300 420 170 400 VS Volts 180 210 250 270 300 350 400 600 250 550 VDRM Volts 130 150 170 200 230 270 300 420 50 270 VS Volts 180 210 250 270 300 350 400 600 80 340 VT Volts 8 8 8 8 8 8 8 8 8 8 IDRM Amps 5 5 5 5 5 5 5 5 5 5 IS mAmps 800 800 800 800 800 800 800 800 800 800 IT Amps 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 IH mAmps 150 150 150 150 150 150 150 150 120 150 CO pF 80 80 80 80 60 60 60 60 80 60 Pins 1-3, 1-4 Pins 3-4 www..com * For individual "UA", "UB", and "UC" surge ratings, see table below. ** Asymmetrical General Notes: * All measurements are made at an ambient temperature of 25 C. IPP applies to -40 C through +85 C temperature range. * IPP is a repetitive surge rating and is guaranteed for the life of the product. * Listed SIDACtor devices are bi-directional. All electrical parameters and surge ratings apply to forward and reverse polarities. * VDRM is measured at IDRM. * VS is measured at 100 V/s. * Special voltage (VS and VDRM) and holding current (IH) requirements are available upon request. * Off-state capacitance is measured between Pins 1-3 and 1-4 at 1 MHz with a 2 V bias and is a typical value for "UA", "UB", and "UC" products. * Device is designed to meet balance requirements of GTS 8700 and GR 974. Surge Ratings IPP 2x10 s Amps 150 250 500 IPP 8x20 s Amps 150 250 400 IPP 10x160 s Amps 90 150 200 IPP 10x560 s Amps 50 100 150 IPP 10x1000 s Amps 45 80 100 ITSM 60 Hz Amps 20 30 50 di/dt Amps/s 500 500 500 Series A B C http://www.teccor.com +1 972-580-7777 2 - 20 (c) 2003 Teccor Electronics SIDACtor(R) Data Book and Design Guide Balanced Three-chip SIDACtor Device Thermal Considerations Package Modified MS-013 6 5 4 1 2 Symbol TJ TS RJA Parameter Operating Junction Temperature Range Storage Temperature Range Thermal Resistance: Junction to Ambient Value -40 to +125 -65 to +150 60 Unit C C C/W +I +I IPP - Peak Pulse Current - %IPP tr = rise time to peak value td = decay time to half value IT IT IS S IH IDRM -V -V VT VT VDRM VDRM VS V S 100 Peak Value Waveform = tr x td +V +V 50 Half Value 0 0 www..com tr td t - Time (s) -I -I V-I Characteristics tr x td Pulse Wave-form 14 Percent of VS Change - % 10 IH (TC = 25 C) 12 8 6 4 2 0 -4 -6 -8 -40 -20 0 20 40 60 80 100 120 140 160 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 100 120 140 160 IH 25 C 25 C Ratio of Case Temperature (TC) - C Junction Temperature (TJ) - C Normalized VS Change versus Junction Temperature Normalized DC Holding Current versus Case Temperature (c) 2003 Teccor Electronics SIDACtor(R) Data Book and Design Guide 2 - 21 http://www.teccor.com +1 972-580-7777 Data Sheets 3 |
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